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Zoom: REECO set for SMD/BGA reworks A3
REECO set for SMD/BGA reworks A3 | Cat. No: RE-ZESTAW-XYZ
Product name:REECO set for SMD/BGA reworks A3
Manufacturer:REECO
Cat. No:RE-ZESTAW-XYZ
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Net price: 2 981,35 EUR (Cena brutto: 3 667,06 EUR)
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The set enables advanced assembly and disassembly of the majority of SMD/BGA components
  • Assembly and disassembly of wide range of SMD components from small CHIPs to BGAs 
  • Microprocessor controlled 
  • 3 working modes: 
    • manual
    • time (according to profile settings) 
    • profile 
  • Using outer software it is possible to: 
    • control and edit the soldering/desoldering process 
    • save unlimited number of profiles
APPLICATION
  • Cooperation with preheater and station stand, enables performing works impossible to do by manual operation and components positioning 
  • REPAIR KIT FOR:
    • X-BOX
    • PLAY STATIONS
    • GRAPHIC CARDS
    • NOTEBOOKS
    • GSM
    • PDA
    • NETWOR EQUIPMENT
    • HOME APPLIANCES
    • TELECOMUNICATION EQUIPMENT
    • MOTHERBOARDS
    • OTHER LARGE PCBs
  • 12 months warranty
ADVANTAGES
  • Optimized heating element power and intelligent hot air temperature control - almost all SMD components can be reworked
  • Wide scale of air flow regulation, starting from soldering with no risk of blowing off the components and soldering paste to large components (also on multilayer PCBs) 
  • Built-in vacuum tweezer that can be started manually or automatically - safe handling of sensitive components
  • Programming or manual outer system controlling (PCBs pre heater) enables to build a professional SMD rework system based on RA-250e
  • Large, contrast display increases comfort of work and keeps the operator updated about current state of all important parameters 
  • Adding assembly/disassembly hot air station with pre heater and stand we get advanced work station and possibility to perform works impossible so far to do
SET CONTAINS
Microprocesor RE-RA250 station for hot air assrmbly and disassembly of SMD/BGA components.
Microprocessor controlled.

PCB preheater RE-PH-A3 - convection heating with a high heat capacity heating plate.
Large working area: 300 x 420 mm

Stand - stabile plate attachement and precise positioning of a component.
Adjustement of X, Y, Z.
PCB mounting with dimensions of 480 x 300 mm.

Software for RE-RA250 station - management of the set, programming, process control and archiving.
Software provides control and modification of the process at the PC monit.

Nozzles
With set - one standard nozzle
Optional - square nozzles

Adapter for nozzles - enabling use of REECO nozzles with stations of many manufacturers.

Vacuum tweezer allows you to lift components. Included with the tweezer are also 3 rubber suction cups for different sizes of components.

Termocouple type K - temperature control 
One thermocouple attached to the station and three thermocoulpes supplied with the preheater.
TECHNICAL DATA
  • Input power: 230 VAC 
  • Power consumption: 800 W max. 
  • Air flow control range: 2-20 l/min, +/- 10% 
  • Temperature control range: 100°C - 450°C 
  • Vacuum tweezer: 0.2 bar 
  • Temperature stability: +/- 2°C 
  • Ext. dimensions: 200 x 230 x 150 mm 
  • Weight: 4.4 kg 
Standard equipment
Optional equipment
  • RA-250e station 
  • Vacuum tweezer 
  • Thermocouple - 2 pcs 
  • Rubber vacuume cups (3 sizes) 
  • 1 round nozzle 
  • Nozzle adapter
  • Preheater RE-PH-A3
  • Stand with handpiece holder
  • Software 
Gallery
Assembly and disassembly unusually placed BGAs on PCB (oblique component)
Mainboards, Laptops

RS300 SET FOR ASSEMBLY AND DISASSEMBLE

Repair of large mainboards
RS300 SET FOR ASSEMBLY AND DISASSEMBLE
Repair of unusually shaped boards
RS300 SET FOR ASSEMBLY AND DISASSEMBLE
Assembly and disassembly of small components Repair of:
Naprawa: 
Mobile phones
PDA
MDA
RS300 SET FOR ASSEMBLY AND DISASSEMBLE
Repair of graphic, audio cards, etc.
RS300 SET FOR ASSEMBLY AND DISASSEMBLE
Repair of network equipment
RS300 SET FOR ASSEMBLY AND DISASSEMBLE