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Zoom: SMD/BGA reballing and rework oven
SMD/BGA reballing and rework oven | Cat. No: FO-928S
Product name:SMD/BGA reballing and rework oven
Manufacturer:FONTON
Cat. No:FO-928S
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Net price: 1 541,39 EUR (Cena brutto: 1 895,91 EUR)
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Oven for SMD/BGA reballing and rework

  • Heats evenly across the surface
  • Aluminium alloy hot plate provides superior energy conduction to the heated application
  • Two-line display:
    • Preset temperature display by the operator
    • Actual temperature display - readable from the built-in thermocouple type K
  • Cover
  • The duration of the process adjustable by potentiometer
  • Built-in advanced radiation type heating elements
  • Thermal insulation preventing heating of housing
Application
928S  hot plate after choosing right stencil and solder balls in an excellent set for fast and always effective BGA and µBGA components regeneration.  
  • BGA reballing 
  • PCB preheating before rework process 
  • Solder removal 
  • SMD/BGA rework 
Advantages
  • Precise, digital control
  • Heats evenly across the surface
  • Temperature measurement using embedded thermocouple type K
  • PID - Proportional, Integral, Derivative - precise temperature control system
  • Cover providing protection of operator
  • Two-line readable display
Two-line readable display1. The actual temperature2. The preset temperature
The duration of the process adjustable by potentiometer Max. 6 minutes
Cooling plate of aluminium alloy included
Technical data
  • Input power: 115VAC/230VAC
  • Maximum power: 1000 W max 
  • Temperature range: 0-400°C
  • Temperature stabilisation: +/-1°C from set temperature 
  • Plate dimensions: 150 x 200 x 13 mm
  • System dimensions: 280 x 240 x 170 mm
  • Heating time to a temperature 200°C: 6 minutes
  • Weight: about 7.5 kg