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Zoom: RD-500II/RD500SII system
RD-500II/RD500SII system | Cat. No: DL-RD-500
Product name:RD-500II/RD500SII system
Manufacturer:DEN-ON
Cat. No:DL-RD-500
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Net price: Price on request
RD-500II/RD500SII BGA rework system
  • Innovative rework system 
  • Max. PCB size: 500 x 600 mm 
  • Max. component size: 50 mm 
  • 3 pre heaters: 
    • top: convective 700 W 
    • bottom: convective 700 W 
    • level: IR emitter 1600 W
APPLICATION
  • Assembly and disassembly wide range of components types: BGA, µBGA, CSP, Flip Chip, Connectors 
ADVANTAGES
  • Versatile possibilities very attractively priced 
  • Perfect component placement accuracy: 25 µm 
  • Highest quality optics
  • 3 highly effective pre heaters
  • Work with large applications (PCB size up to 500x600 mm) 
  • Protection preventing PCB from deformation and component pre heating 
  • Efficient and advanced software 
  • Attached set for solder paste dispensing 
  • Excellent repeatability of process 
  • 2 points cooling system
Profile creating with use of solder points temperature measurements (e.g. solder balls) and top of the component.


Exact temperature measurement with 5 thermocouples and computer analysis, prevents component overheating and providing choice of the most effective process parameters. 


Advanced optic system, PC controlled, guarantees precision component positioning.

TECHNICAL DATA

RD-500II
RD-500SII
Max. PCB size
500x600 cm
400x420 cm
Positioning accuracy
0.025
Component size
2 - 50 mm
Bottom pre heater
hot air, 700 W
Top pre heater
hot air, 700 W
IR pre heater
1600 W
(400 W x 4)
800 W option

(400 W x 2)

IR pre heater temperature range
0 ~ 500°C