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Zoom: RS-300Q set for SMD/BGA rework
RS-300Q set for SMD/BGA rework | Cat. No: RE-RS300Q
Product name:RS-300Q set for SMD/BGA rework
Manufacturer:REECO
Cat. No:RE-RS300Q
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Inquiry:
Net price: 2 901,63 EUR (Cena brutto: 3 569,00 EUR)
Purchase:
QTY
RS300Q SET FOR ASSEMBLY AND DISASSEMBLE OF WIDE RANGE OF SMD COMPONENTS, INCLUDING BGA COMPONENTS
  • Integrated device: HOT-AIR station, quartz preheater and control computer
  • 3 zone quartz preheater
  • Preheater of A3 size
  • Power of lower preheater: 3.4kW
  • Power of upper preheater: 500W
  • Smooth temperature adjustment of lower preheater and air flow
  • 3 external thermocouple socket
  • Stabile stand with adjustable XYZ axis
  • Intuitive software
  • Large, 7-inch colour touch screen
  • Possibility of programming an unlimited number of profiles
  • Editing process parameters in real time
APPLICATION

SET FOR REPAIRS OF:
  • X-BOX
  • PLAY STATION
  • GRAPHIC CARDS
  • NOTEBOOKs
  • GSM
  • PDA
  • NET DEVICES
  • HOME APPLIANCES
  • TELECOMUNICATION EQUIPMENT
  • OTHER LARGE MAIN PCBs

Set enables work also with components:
ADVANTAGES

  • High power of heating element and stable stream of air - work with components CHIP, SO, QFP, PLCC, BGA
  • Non-contact assembly and disassembly of components with hot air
  • Microprocessor controlled, precise stabilization of the temperature and air flow
  • Large and clear display
  • Longer service life of the heating element - microprocessor protection
  • Large selection of stainless steel nozzles
  • Nozzles replaced in seconds
  • As standard round nozzle and modern nozzles installation adapter
  • The unique cooling function of heating element after power off
Quartz heating elements covered with steel protective mesh
TECHNICAL DATA

  • Power supply: 230 V AC, 50-60 Hz 
  • Power: 3.4kW
  • Air flow control range: 2-20 l/min
  • Temperature range: 100oC - 350oC
  • Outer dimensions: 480mm x 460mm x H 190mm
  • Weight: about 20kg

Standard equipment
Optional equipment
  • RS-300Q station 
  • Power cord 
  • Adapter for REECO nozzles 
  • RE-PN50 nozzle
  • Set of stands
Capabilities

Assembly and disassembly unusually placed BGAs on PCB (oblique component)
Mainboards, Laptops

RS300 SET FOR ASSEMBLY AND DISASSEMBLE

Repair of large mainboards
RS300 SET FOR ASSEMBLY AND DISASSEMBLE
Repair of unusually shaped boards
RS300 SET FOR ASSEMBLY AND DISASSEMBLE
Assembly and disassembly of small components Repair of:
Naprawa: 
Mobile phones
PDA
MDA
RS300 SET FOR ASSEMBLY AND DISASSEMBLE
Repair of graphic, audio cards, etc.
RS300 SET FOR ASSEMBLY AND DISASSEMBLE
Repair of network equipment
RS300 SET FOR ASSEMBLY AND DISASSEMBLE