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ASC solder paste inspection/measurement systems

 
ASC solder paste inspection/measuring systems 
ASC systems offers non-contact, high resolution measurement technology.
Use of laser sensor and triangulation method , enables data collection of XYZ dimensions and illustrating them on graph. Measurement is completely non-invasive and delivers exact, repeatable results. All data is collected and registered in ASCII format. Results can be imported to software for later exact analyses.
Systems additionally provides precise measurements of e.g.: thickness of ceramic base layers, BGA, components and pads, integrated circuits leads, leads, electroplated connections and coatings, thickness of junctures, convexities and warps of printed circuits etc.

MASTER 150-3D solder paste measurement system

MASTER 150-3D solder paste measurement system

  • Three-dimensional solder paste measurements
  • Fully automatic measurement of capacity and height
  • 3D colour measuring objects profiles or features
Price: on request
Zoom: MASTER 150-3D solder paste measurement system
MASTER 150-3D solder paste measurement system | Cat. No: ASC-Master
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AP212 solder paste measurement system

AP212 solder paste measurement system

  • High resolution system to PCB positioning with three-dimensional measurement technique
  • Automated volume, height measurement
Price: on request
Zoom: AP212 solder paste measurement system
AP212 solder paste measurement system | Cat. No: ASC-Master-AP212
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