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Advanced BGA rework systems

Advanced BGA rework systems Rework system for elements type: PBGA, µBGA, CSP, Flip Chip and all SMD.

BGA components mount is essentially different from other SMD components mounts. Soldering points in quantity even hundreds are located underneath of component housing which become invisible after placing BGA component on PCB. This requires soldering technology similar to multi zone soldering oven process. To avoid shortages and ensures exact connections, no less important is correct component positioning before mounting.

Positioning


Positioning of mounted component with accuracy 25 µm ensures high resolution vision system, which on screen gives magnification of overlaid images of PCB solder points and ready to solder component's leads. Using appropriate X, Y, Z axes knobs adjusting aloud us to precision harmonizing mounted BGA solder points with corresponding points on PCB.

Soldering process

Performs by non contact hot air blow method with fixed and stabilized temperature. Process is performed in four stages: pre heating, soak, reflow and cooling. Each stage parameters (time, temperature and air flow) are individually selected depending on component type and size. All parameters are gathered in profile and saved in system's memory, then they can be used when needed without necessity of renewed entering. Real time process is illustrated as a graph on monitor screen, which gives complete process control and enables operator to make possible real time parameters modification.


RD-500II/RD500SII system

RD-500II/RD500SII system

  • Innovative rework system
  • Maximum PCB size:
    500 x 600 mm
  • Maximum component size:
    50 mm
Price: on request
Zoom: RD-500II/RD500SII system
RD-500II/RD500SII system | Cat. No: DL-RD-500
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THERMOFLO 1700 system

THERMOFLO 1700 system

  • Precision, high resolution optic system
  • Maximum PCB size:
    305 x 305 mm
  • Maximum component size:
    65 x 65 mm
Price: on request
Zoom: THERMOFLO 1700 system
THERMOFLO 1700 system | Cat. No: PC-80070466
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THERMOFLO 2700 system

THERMOFLO 2700 system

  • Mixed pre heating system (hot air or IR)
  • Maximum PCB size:
    610 x 610 mm
  • Maximum component size:
    65 x 65 mm
Price: on request
Zoom: THERMOFLO 2700 system
THERMOFLO 2700 system | Cat. No: PC-80070469
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