|
|
Advanced BGA rework systems |
|
|
|
 Rework system for elements type: PBGA, µBGA, CSP, Flip Chip and all SMD.
BGA components mount is essentially different from other SMD components mounts. Soldering points in quantity even hundreds are located underneath of component housing which become invisible after placing BGA component on PCB. This requires soldering technology similar to multi zone soldering oven process. To avoid shortages and ensures exact connections, no less important is correct component positioning before mounting.
Positioning
Positioning of mounted component with accuracy 25 µm ensures high resolution vision system, which on screen gives magnification of overlaid images of PCB solder points and ready to solder component's leads. Using appropriate X, Y, Z axes knobs adjusting aloud us to precision harmonizing mounted BGA solder points with corresponding points on PCB.
Soldering process
Performs by non contact hot air blow method with fixed and stabilized temperature. Process is performed in four stages: pre heating, soak, reflow and cooling. Each stage parameters (time, temperature and air flow) are individually selected depending on component type and size. All parameters are gathered in profile and saved in system's memory, then they can be used when needed without necessity of renewed entering. Real time process is illustrated as a graph on monitor screen, which gives complete process control and enables operator to make possible real time parameters modification.
|
|
|
|
- Economic Summit system
- Maximum PCB size:
458 x 560 mm
- Maximum component size:
50 mm
|
|
|
- Automatic Summit system
- Maximum PCB size:
458 x 560 mm
(option 559 x 762 mm)
- Maximum component size:
75 mm
|
|
|
- Most advanced automatic Summit system
- Maximum PCB size:
458 x 560 mm
(option 559 x 762 mm)
- Maximum component size:
75 mm
|
|
|
- Innovative rework system
- Maximum PCB size:
500 x 600 mm
- Maximum component size:
50 mm
|
|
|
- Mixed pre heating system (hot air or IR)
- Maximum PCB size:
610 x 610 mm
- Maximum component size:
65 x 65 mm
|
|
|
- Precision, high resolution optic system
- Maximum PCB size:
305 x 305 mm
- Maximum component size:
65 x 65 mm
|
|
|
- Semiautomatic Summit system
- Maximum PCB size:
458 x 560 mm
- Maximum component size:
75 mm
|
|
|
- Economic Summit system
- Maximum PCB size:
508 x 457 mm
- Maximum component size: 50 mm
|
|
|
|
| Renex Catalogue
|
|
|
|
Catalogue is free of charge as a addition to ordered products.
 Download
|
|
Contact |
|
mobile: +48 605 370 102
+48 54 413 83 00
+48 54 231-10-05
+48 54 411-25-55
fax:.+48
54 411-25-56
email:
office@renex.info
Al.
Kazimierza Wielkiego 6E
87-800
Wloclawek
Poland |
|
|
|
|
|
|
|
|
|
|
|
|
|
RENEX is one of the largest and longest running Polish companies, supplying equipment for the electronics industry and related industries. The basis of offer are: soldering stations, industrial furniture, SMD machines, wave soldering, soldering ovens, solder paste printers, microscopes, soldering adhesives, solder pots, cleaning preparations, X-rays for BGA after soldering inspection, antistatic, pliers, cutters, tweezers , etc.
|
|
