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Selective soldering systems

Selective soldering systems

Advanced electronic applications often elaborates mixed technologies - components need to be assembled in SMD and PTH technology. In production environment soldering of such components is accomplished by highly effective aggregates.

Modern systems serving a purpose of achieving such goals are EBSO selective soldering aggregates.

Other then classic wave soldering, where large parts of PCB is covered with solder at the same time, in selective system solder is applied only to selected part of PCB as well as just single soldering points. Solder is directed to solder point by exchangeable nozzles with shapes selected to the required component. Soldering is performed in nitrogen inerting environment. Components placed on PCB can be at the same time in mixed technology (PTH and SMD).

SPA-400NC selective soldering system

SPA-400NC selective soldering system

  • Max. PCB size: 400x400 mm
  • Unique software processing image of scanned PCB and automatically sets soldering program
Price: on request
Zoom: SPA-400NC selective soldering system
SPA-400NC selective soldering system | Cat. No: EB-SPA400
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SPA R selective soldering system

SPA R selective soldering system

  • Maximal PCB size: unlimited
  • Device suitable for use in lead-free technology
Price: on request
Zoom: SPA R selective soldering system
SPA R selective soldering system | Cat. No: EB-SPA-R
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